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CES 2025: Qualcomm and Hyundai-Mobis reduce the number of chips

Qualcomm and Hyundai Mobis want to jointly build a new generation of the high-performance computing platform (HPC) and, above all, take the ADAS systems to a new level.

One for All: Hyundai was represented through its subsidiary Mobis. There, a chip is supposed to combine ADAS and less important display functions. | Photo: J. Soller
One for All: Hyundai was represented through its subsidiary Mobis. There, a chip is supposed to combine ADAS and less important display functions. | Photo: J. Soller
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Hyundai-Mobis was also represented at CES with a large booth. Here, too, the focus was less on the models from Hyundai or Kia and more on the software. According to Qualcomm, the basis of the technological collaboration will also be the Snapdragons. Specifically, the Snapdragon Ride Flex System-on-Chip (SoC) platform from Qualcomm Technologies and the Snapdragon Ride Automated Driving Stack with the advanced software and sensors from Hyundai Mobis. Both are to be combined to deliver a comprehensive system solution that supports advanced infotainment and driver assistance systems (ADAS) and, of course, aims to enhance the user experience for customers.

Advantage for Customers and Service: a Powerful Chip for Everything

The advantages: In this way, the aim is to bundle the powerful processing capabilities and the software framework of the Flex SoC, which encompasses cockpit, advanced driver assistance systems (ADAS), and automated driving (AD) on a single chip. This also brings advantages for users and the service, because: Functions and software in modern vehicles are becoming increasingly elaborate and complex. Therefore, central computers are crucial for efficient management of all functions.

The Flex SoC is intended to be able to handle flexible, mixed, and safety-critical workloads in the future. According to Qualcomm, it supports both safety-critical and non-safety-critical applications on a single chip with a solution that addresses freedom from interference (FFI). When we asked whether it would all be very expensive, we were told that scalability from the entry-level to the premium segment was planned for both hardware and software.

In the end, Hyundai Group models are expected to combine complex instrument displays, driving and parking solutions, and ADAS systems based on the Snapdragon Ride Automated Driving Stack. Soo Kyung Jung, Executive Vice President and Head of the Business Unit for Automotive Electronics at Hyundai Mobis, was pleased about the continuation of the partnership with Qualcomm and stated:

“We are pleased to continue our collaboration with Qualcomm Technologies to develop a comprehensive system solution that provides efficient computing power while meeting the highest safety, security, and reliability standards.”

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O.H. Kwon, Senior Vice President and President of Qualcomm APAC, added:

“With the Snapdragon Ride Flex SoC, we are making SDV technology accessible and more cost-effective for automotive manufacturers so that they can seamlessly transition to an integrated, open, and scalable architecture across all their vehicle segments. We look forward to this continued partnership with Hyundai Mobis and to seeing our Ride Flex solution in future vehicles of global OEMs.”

What does that mean?

The more functions you can bundle on a chip, the better. However, it must not become unaffordable. This is what Qualcomm developed the Snapdragon Ride Flex System-on-Chip for, which will be used in various configurations in the Hyundai group with its many products from small cars to the Genesis luxury class.

```Translated automatically from German.
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